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Beschrijving
This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis. The CD-ROM presents the complete content of the book in fully searchable Adobe Acrobat PDF format. Contents: Fault Isolation of the Electrical Fail over Sample Presentation; Imaging and Material Analysis; Failure Analysis Process Flows on Individual Components; System-Level Performance; Manufacturing yield Enhancements; Packaging Issues and Solutions; Hot Topics such as Optical Probing and Tester-Driven Failure Analysis.
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