Features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Table of Contents
Includes papers relating to the analysis of integrated circuits, MEMS, nanodevices, optoelectronics, discrete and passive components, electronic packaging, card level components, and electronic systems in the following areas:

New and emerging analytical techniques, sensors, and instrumentation

Diagnostic testing and debug
* Physical fault isolation (optical, thermal, magnetic, etc.)

Electrical characterization and nanoprobing

Scanning probe technology

Microscopy (SEM, TEM, light microscopy, etc.)

Physical circuit-edit techniques (FIB, laser, etc.)

Sample preparation (milling, polishing, etching, grinding, etc.)

Chemical and materials analysis (Auger, SIMS, RBS, etc.)

Metrology and in-line characterization and analysis

Yield and reliability enhancement

Competitive analysis

Image processing

Analytical thought-process

Laboratory and environmental safety and green processes

Automation

Laboratory management and finance

Future challenges, such as those relating to the deep nanoscale regime