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Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
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SPIE Press
Multichip Modules 1995 International Conference
€ 0,00
Institute of Electrical and Electronics Engineers
Multichip Module: Conference Proceedings: 1995
€ 0,00
Institute of Electrical and Electronics Engineers
Multichip Module: Conference Proceedings: 1996
€ 0,00
W.K. Jones || Gábor Harsányi
Multichip Modules with Integrated Sensors
€ 227,50
Mysore Sriram || Sung-Mo (Steve) Kang
Physical Design for Multichip Modules
€ 202,76
W.K. Jones || Gábor Harsányi
Multichip Modules with Integrated Sensors
€ 142,68
Mysore Sriram || Sung-Mo (Steve) Kang
Physical Design for Multichip Modules
€ 202,76
Fred W. Kear
Hybrid Assemblies and Multichip Modules
€ 230,93
Institute of Electrical and Electronics Engineers
Multichip Module: Conference Proceedings: MCMC '94
€ 0,00
John H. Lau
Chip On Board: Technology for Multichip Modules
€ 277,85
